3U VPX RFSOC+DSP Digital Signal Acquisition and Processing Module
The IW-3UVPX-ZU47+DSP is a 3U VPX commercial off-the-shelf direct RF acquisition and processing system.
Model: IW-RFSOC-4R-DSP
Category:
Zynq UltraScale+ RFSOC Development Board
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- Commodity name: 3U VPX RFSOC+DSP Digital Signal Acquisition and Processing Module
- 型号: IW-RFSOC-4R-DSP
The IW-3UVPX-ZU47+DSP is a 3U VPX commercial off-the-shelf direct RF acquisition and processing system.
The IW-3UVPX-ZU47+DSP is a 3U VPX commercial off-the-shelf direct RF acquisition and processing system that employs a conventional radar signal-processing architecture, featuring a third-generation Xilinx RF SoC (XCZU47DR) paired with a TI TMS320C6678ACYPA DSP. It maximizes I/O channel density, reduces the complexity of the RF signal chain, and enables heterogeneous processing capabilities.
⊚ The FPGA and DSP are equipped with data transmission interfaces such as the EMIF interface and the SRIO interface;
⊚ Both FPGA and DSP programs achieve power‑on self‑loading via on‑board and off‑board memory; remote loading is performed over the Ethernet port (later replaced by a low‑speed serial port).
⊚ The operating clock source can be either an external 100 MHz input clock or the on-board crystal oscillator; all other clocks are generated by the on-board crystal oscillator.
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Performance Metrics
Main chip
● FPGA: XCZU47DR-2FFVG1517I RFSoC
● DSP: TI TMS320C6678ACYPA
Interface
● X4ADC (14-bit, 5 GSPS) ports
Memory
● 47DR-PL: 2x DDR4 (256M, 16bit)
● 47DR-PS: 1x DDR4 (256M, 16bit)
● DSP: 1x DDR3 (512 MB, 16-bit)
Board power supply
● VPX power supply interface
P.S.
● 1x QSPI flash (2 Gb) with a pre‑configured firmware image
● 1x ETH (connected to the VPX interface)
● 1x JTAG debugging interface
PL
● RS422 serial port
● LVDS
● SRIO
● EMIF
Ambient temperature requirements
● Operating temperature: -40°C to 70°C
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The IW-3UVPX-ZU47+DSP is a 3U VPX commercial off-the-shelf direct RF acquisition and processing system that employs a conventional radar signal-processing architecture, featuring a third-generation Xilinx RF System-on-Chip (RFSoC) XCZU47DR paired with a TI TMS320C6678ACYPA DSP. It maximizes I/O channel density, reduces the complexity of the RF signal chain, and enables heterogeneous processing capabilities.
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