16GB HBM Signal Aggregation Module
The IW_VU47P_QSFPX20 utilizes two DDR4 connectors, model 90411-151231, mounted on the XCVU47P to form two DDR4 channels, each with a 64-bit data bus width. In addition, the module integrates two 2 Gbit NOR FLASH chips for storing boot configurations and system files. It also features an extensive array of peripheral interfaces, including 20 QSFP ports, one J30J port, one Gigabit Ethernet port, and eight GPIO input ports along with eight GPIO output ports.
Model： IW_VU47P_QSFPX20
Category:
Zynq UltraScale+ RFSOC Development Board
Keywords:
Hotline:
- Product Details
- Product Specifications
- Product Features and Applications
- Shipping List
-
- Commodity name: 16GB HBM Signal Aggregation Module
- 型号: IW_VU47P_QSFPX20
The IW_VU47P_QSFPX20 utilizes two DDR4 connectors, model 90411-151231, mounted on the XCVU47P to form two DDR4 channels, each with a 64-bit data bus width. In addition, the module integrates two 2 Gbit NOR FLASH chips for storing boot configurations and system files. It also features an extensive array of peripheral interfaces, including 20 QSFP ports, one J30J port, one Gigabit Ethernet port, and eight GPIO input ports along with eight GPIO output ports.
The IW_VU47P_QSFPX20 utilizes two DDR4 connectors, model 90411-151231, mounted on the XCVU47P to form two DDR4 channels, each with a 64-bit data bus width. In addition, the module integrates two 2 Gbit NOR FLASH chips for storing boot configurations and system files. It also features an extensive array of peripheral interfaces, including 20 QSFP ports, one J30J port, one Gigabit Ethernet port, and eight GPIO input ports along with eight GPIO output ports.
-
Performance Metrics
-
Product Features
- The XCVU47P FPGA is an FPGA designed for high‑bandwidth data processing. By integrating HBM on‑chip, it overcomes the external bandwidth limitations that have traditionally constrained conventional FPGAs when handling large volumes of data, making it ideally suited for applications such as data center acceleration, network processing, radar systems, and high‑performance computing.
- Extensive Documentation and Resources: We provide comprehensive board‑level documentation and design resources, offer guidance for secondary development, and continuously gather customer feedback to refine our support over the long term.
- Low cost and high value: Offers a lower price and richer features compared to similar products.
- High integration: Leveraging the advantages of MPSoCs, complex and heterogeneous tasks can be executed on a single chip, significantly shortening the debugging and development cycle compared to traditional multi-chip heterogeneous architectures.
Previous page
Next page
Previous page
Next page
Document Download
Product Inquiry
Contact Us
Phone:+86-29-84508304
Website: www.interwiser.com
Address: 25th Floor, Building E, Xidian Science & Technology Park, No. 168 Kechuang Road, Yanta District, Xi'an City
